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Future of Global 3D IC and TSV Interconnect worth $6.55 billion by 2016

Enquiry Before Getting it:- http://bit.ly/1w95Z6l

the total 3D IC market is expected to reach $6.55 billion by 2016 at a CAGR of 16.9% from 2011 to 2016.

Get PDF :- http://bit.ly/1vHLs5Y

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