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New year with a new image
---Tensan takes efforts to expand Expand the Vietnamese market

2018 is the key year for the development of Tensan. At the beginning of the new year, Tensan conducted customer's return visit to Vietnam from January 2 to January 11 to understand clients' planning and purchasing needs in 2018, to find and solve problems encountered by customers during product use and to provide customers with comprehensive technical services.
In the process of customer visit, customers are satisfied with the products of Tensan, because of the reliable quality and the reasonable price. We have sent people on several occasions to visit customers on the spot and understand the needs of customers, this is what other companies do not have. We sincerely thanks for the recognition of customers and at the same time, we visited the customer's workshop on the spot to see the shortcomings in the process of using the glue. According to the customers' actual conditions, we made our professional suggestions.
At present, the development of LED market in Vietnam is in the ascendant. With the manufacturing demand of the country, more and more LED enterprises will appear in Vietnam. China LED enterprises also regard Vietnam as one of the important emerging markets. As a professional enterprise of silicone glue, thermal grease and equipment, Tensan strives to become the first choice brand of silicone glue for customers in Vietnam market by 2019, providing customers with full range of solution for silicone application. To provide Vietnam customers with good quality, excellent price and high performance products.
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Introduction to Power Glue (2)
3.Power glue classification and features
 Electronic components bonding and fixing.
 Waterproof, thermal Thermal conductivity, potting
 PCB board protection (excellent Moisture, salt spray, mildew)
 Heating element cooling
 PCB chip components bonding and fixing.
Electronic components bonding and fixing
Purpose:In order to prevent the electronic components from falling off lead to failure of the power supply, the use of adhesive to aid its bonding and fixing.
Performance requirements:
Firm bonding , Good temperature resistance, excellent electrical properties and good flame retardant;
Available types:
UL yellow glue, white glue for power supply.
Advantages and disadvantages of UL yellow glue and power white glue
 Advantages of UL yellow glue: strong initial viscosity, high bonding strength,room temperature curing,accelerated curing by heating.
 disadvantages:with toluene solvent, which contains certain toxicity; containing volatile, pungent smell, has a certain corrosive to some material; heat resistance, poor cold resistance, high curing shrinkage rate, much hardened after curing, resulting defective repair difficulty; poor storage stability, easy stratification, gel and precipitation; liquid flammable.
 Advantages of power white glue:
 Neutral, non-toxic non-corrosive, non-irritating odor; curing does not release heat, small shrinkage rate is ; Elastomer with good shock and impact resistance; excellent temperature performance; excellent electrical properties and weather resistance; not flammable.
 Disadvantages:
 Poor mechanical properties; poor wear resistance.
Waterproof thermal potting
Purpose:Protecting the power circuit board and electronic components from water and reducing the temperature of heat-dissipating components to ensure the normal function and service life of the electronic components effectively.
1.To timely conduction the heat of heat components, reducing temperature;
2.Provide waterproof protection for circuit boards and electronic components;
3.Flame retardant, excellent electrical properties.
Available Types: Epoxy Potting, Polyurethane Potting, Silicone Potting.
Advantages and disadvantages Epoxy potting
 High adhesion
 Small curing shrinkage rate;
 Chemical resistance and good stability;
 Excellent electrical performance;
 Good process performance, product size and stability;
Low water absorption.
 High polarity and reactivity;
 Low surface energy, strong penetration;
 Internal stress is small, excellent fatigue resistance;
 Excellent low temperature and ultra-low temperature performance ;
Wear-resistant, corrosion-resistant
 Superior high and low temperature performance
 Low stress
 Good Seismic performance
 Superior electrical performance
 Excellent weatherability
 Non-flammable
 Curing does not radiate heat
 Physiologically inert

 Curing physical brittle, low elongation;
 Heating during curing
 High stress
 Poor resistance to mechanical and thermal shocks
 Poor weatherability;
 Flammable,toxic substances released when burning
 Toxicity
 Relative humidity higher than 70% can not be bonded;
 High temperature performance is poor.
 Poor mechanical properties
 Poor wear resistance
 Poor oil and solvent resistance
PCB board protection (three anti-paint / three anti-glue)
Three anti-paint is a special formula of paint, used to protect the circuit board and its related equipment from environmental erosion, can effectively protect a variety of electronic circuit boards, moisture, put corrosion, salt spray and thus Improve and extend their service life, to ensure the safety and reliability of use.
Category: Acrylic three anti-paint, anti-polyurethane three-paint, silicone three anti-paint.
Acrylic three anti-paint: After curing forming a layer of hard film in the board, which is moisture-proof, anti-corrosion and anti-salt spray. You can choose spray, brush, it is cheap for ordinary consumer electronics products. Such as televisions, computers, electric carsand mobile phone instrumentations.
Polyurethane three anti-paint: After curing the film formed on the board harder than acrylic acid, moisture, corrosion, salt spray are better. Completely free of toluene, odorless, flame retardant. Suitable for industrial control, power supply, air conditioning, inverter and other manufacturers.
Silicone three anti-paint: After curing to form a layer of transparent flexible protective film, with superior insulation, moisture, leakage, dust, corrosion, anti-aging, corona resistance and other properties. Can enhance the anti-fouling capacity of electronic circuits and components to prevent corrosion of solder joints and conductors can also play a shielding and eliminate electromagnetic interference, to prevent the role of short circuit, improve circuit board insulation. Therefore, a wide range of applications and high-end electronics industry.
4.Tensan Power Products
 bonding and fixing Power glue
TS55 Series (General Purpose Product)
 One component, room temperature curing, easy to use;
 High extrusion rate, can be used with equipment for assembly line operation, high production efficiency;
 Neutral cross-linked product, non-irritating odor, no corrosion of most metals and plastics;
 Elastomer, with good shock resistance and deformation capacity;
 Excellent adhesion, have good adhesion to most of the metal, glass, plastic, ceramics and other materials;
 Excellent resistance to hot and cold alternating, anti-aging properties and electronic insulation properties;
 RTI temperature can reach 150 degrees, flame retardant grade UL94V-0.

Packaging: 100ml / tube, 300ml / tube, 2.6L / tube
TS-62 Series (fast-drying Products)
 Two-component, use after mixing according to a specific ratio, can cooperate with equipment in dispensing operations
 Fast surface dry, the efficiency is doubled comparing with the common bonding product in the market
 Neutral cross-linked product, non-irritating odor, no corrosion to most metals and plastics;
 Elastomer, with good shock resistance and deformation capacity;
 Strong adhesion to most of the metal, glass, plastic, ceramics and other materials
 Excellent resistance to hot and cold alternating, anti-aging properties and electronic insulation properties;
 RTI temperature can reach 150 degrees, flame retardant grade UL94V-0.

Packaging: 50ml /syringe (double syringe);
 Waterproof thermal potting
TS88 series (1: 1 addition waterproof thermal potting)
Features: no adhesion, not exothermic when curing, non-shrinking; high thermal conductivity, heat curing, waterproof rating up to IP65;
Packing: 20kg / barrel, 25kg / barrel;
 Waterproof thermal potting
TS-99 Series (10: 1 Condensed Waterproof Thermal Potting)
Features: Adhesion, not exothermic when curing, slight contraction; General thermal conductivity, no heat curing, waterproof rating up to IP67
Packaging: A 20kg / barrel; B : 2kg / bottle;

Thermal silicone / thermal grease
Smear on part of the heating element, to export the heat from the element in time, there by reducing the temperature of the element to ensure the normal function and service life of the element.

1.Q:Why the surface of the glue bonds rather slowly?
A: Check the temperature and humidity of the sizing site, the Ideal curing condition is 25℃,RH55%.
2.Q: IF the silicone adhesives and sealants is more dilute the better.
A: No, the bonding effect can be achieved until certain accumulation of adhesive sealant between the components or PC board.
3.Q:How to choose the hardness of the glue after curing?
A:As silicone adhesives and sealants, it must have a certain hardness and strength after curing to strongly bold the components without displacement.
4.Q:Why the glue flow rate becomes slow under the same pressure?
A:The glue in the tail part of tube the contact with air, causing crusts which lead to increased piston friction. It is recommended to increase the pressure or remove tail crust.
5.Q:Why in the sealed space the electrical insulation will down after the dispensing?
A:Product sealing time is so early that small molecules within the glue can not overflow. It is recommended to extend the exposure time of glue.
6.Q: After dispensing for some time, how to solve the black and blue thing appear on the copper of PCBA.
A:The glue may be non-alcohol-based glue, small molecules has a certain corrosive to the copper foil. It is recommended to use de-alcohol glue.

1.Q:Why adhesive does not cure for a long time?
A:In the sealed space, dispensing too much, the water contented is not enough to supply glue curing. It is recommended to extend the exposed time or reduce the amount of dispensing.
2.Q:How to choose the flame retardant grade of power supply adhesive?
A:When power supply works, the shell is in sealed environment with a high temperature, so UL84 V0 grade flame retardant glue is necessary.
3.Q:After the aging test of glue, why it will turn yellow?
You must distinguish it is glue surface or internal yellowing. If the surface ,it is a volatile material on PCBA adsorbed on the glue surface usually aging, the situation will not cause Internal change of glue, and it does not affect the glue mechanical properties and electrical properties. If the glue are yellowing inside and outside, it is glue itself can not bear high temperature, the glue has been chemical change. It is recommended to remove the yellow glue and replace with temperature resistant one.
4.Q:Why the power supply thermal pottants does not cure or or stick in some surface contact with glue?
A:This is colloidal poisoning, the catalytic reaction between general formula for Pb, P, S, N plasma compounds and additive potting, resulting in glue poisoning. it is recommended to avoid rosin flux, wash water which is not dry, lead solder, some rubber seals and heat shrink tubing. You’d better use E-300 coating solution before filling.
5.Q:Why bubbles appear when using thermal pottants?
A: The Potting is too thick or there is no vacuum defoaming after hand-stirring.
Suggestions:Using sub-filling method, irrigating part of the glue, waiting for 3-5 minutes to irrigate the second, and followed by a similar approach.

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AUTO-machine compound
Two-component power dispenser
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Introduction to Power Glue (1)
1.Silicone Introduction
What is silicone?
Silicone, an Organic silicon compound, refers to a compound that contains Si-O bonds and at least one of the organic groups is directly attached to a silicon atom. It is also customary to regard those compounds that link organic groups with silicon atoms through oxygen, sulfur, nitrogen and the like as organic silicon compounds.
Silicone is widely used because of its unique structure, combining the properties of inorganic and organic materials.Among them, the polysiloxane composed of siloxane bond (Si-0-Si) as a skeleton is the largest number of organic silicon compounds, the most studied, the most widely used, accounting for more than 90% of the total amount.

Basic property
Low surface tension, low viscosity coefficient, high compressibility, high gas permeability, high and low temperature resistance, electrical insulation, oxidation stability, flame retardant, hydrophobic, corrosion resistance, non-toxic and tasteless, physiologically inert。
Main products:
Silane coupling agent, silicone oil, silicon resin, silicone rubber;

Main effect:
Sealing, bonding, lubrication, coating, surface activity, stripping, defoaming, defoaming, waterproof, moisture-proof, inert filling and so on.
Applications:Applications: Aerospace, electrical and electronic, construction, transportation, chemical, textile, food, light industry, medical and so on.

2.Development history of silicone
In 1863, French scientists Freeline and Kraffz synthesized the first Si-C bond-containing organic compound -SiEt4 (tetraethylsilane) from SiCl4 and ZnEt2. By 1903 forty years, people have gradually synthesized a lot of tetraethyl silane derivatives.
This period is the founding period of silicone chemistry, customarily referred to as the first phase.
In 1904-1937, F Chem Kipping, a British chemist, used the Grignard reaction to synthesize hydrolysable silanes of different functionalities to form the basis of the future silicone industry.
These three decades is the growth of organic silicon chemistry, customarily referred to as the second phase.
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Product Specifications
model:TS8877(Silicone gel)
This product is an aluminum shell, plastic tube single-component packaging of plastic materials, one additive silicone material can cure at room temperature or increasing heat.This two-component flexible silicone is designed for potting and protection of electronics in harsh conditions. The product is cured to form elastic cushioning material, which can reduce the mechanical stress and tension caused by mechanical, thermal shock and vibration, easy to repair, high-frequency electrical performance, solvent-free and no curing by-products.

● An elastomer No hardness, no stress, with good shock resistance to shock
● Can be cured at room temperature or fast curing when increasing heat, almost non-shrinkage
● High-frequency electrical performance is stable, solvent-free, no curing by-product release
● Repairable

3.Typical Application
Cushioning of precision electrical and electronic components, seismic protection

4.Technical performance
Before curing:
Test items standard unit A component B component
Exterior Visual --- transparent transparent
Viscosity GB/T 2797-1995 mPa·s(25℃) 1800±400 1200±400
Density GB/T 13354-92 g/cm3(25℃) 0.98±0.05 0.98±0.05
Operating process:
Items Unit / condition Value
mixing ratio weight ratio 1︰1
Operable time min(25℃) 60~90
Curing time H/℃ 0.5/80
Color after curing Visual transparent
After curing:
Items standard unit Value
Hardness GB/T 531-83 Shore A 0
Volume resistivity GB/T 1410-2006 (DC500V)Ω· cm3 1.0×1014
Dielectric strength GB/T 1698-2005 kV/mm(25℃) >15
Temperature range ℃ -60~200
Note: All data above is measured after curing for 7 days at 25 ° C, 55% RH.
The product is supplied in two packs, mixing Part A and Part B in the specified weight ratios. After the A component and the B component are thoroughly mixed, gently agitate to reduce the amount of air mixed. The mixed material is allowed to stand for 5 minutes before pouring, which is advantageous for removing the air mixed in during mixing. If you still have bubbles, you need vacuum degassing. Taking into account the expansibility of the material, the volume of the degassing vessel used should be at least 4 times the volume of the liquid. Vacuum bubbles from 28 to 30 inches of mercury can be used to remove air bubbles contained in the mixed material. Continue to vacuum until the liquid expanded and then returned to its original volume, the bubble will be completely eliminated. This process can take anywhere from 5 minutes to 10 minutes, depending on the amount of air entrained during mixing. In order to achieve the best curing effect, it is necessary to use glassware and glass or metal mixing equipment. Try to keep it steady while mixing to prevent mixing with excess air.

2.The applicable period / operating time
The curing reaction starts at the beginning of the mixing process. The initial curing phenomenon is the gradual increase in viscosity, and finally become a flexible gel. The pot life is defined as the time it takes for the viscosity to increase twice as long after the components A and B (main and curative) are mixed. Please refer to the operation time of each model product.

3.Processing and curing
After the product has been thoroughly mixed, it can be directly injected / dispensed into the parts requiring curing for curing. Take care to minimize the air mix. If practicable, especially potting components have many micro-holes, should be as far as possible under vacuum plastic environment. If you can not use this technology, the components should be vacuum degassing after using the product potting. The product can be cured either at room temperature (25 ° C) or thermally. Product specifications listed in the product ideal curing conditions. The product should be pre-agitated before use because of the partial precipitation that can occur during shipping and storage.
4.Preparation of the surface
Before use, the surface of the components to be encapsulated, coated or glued is cleaned to remove the oil and other impurities on the surface (can be washed with organic solvents such as alcohol and acetone).

5.Available temperature range
For most applications, the product can be long-term use in the temperature range of -60 to 200 ℃. However, under the condition of low temperature and high temperature, the performance performance of the product in some special applications can become very complicated, so additional factors need to be taken into consideration. In terms of low temperature performance, although the heat cycle can be carried out at about -60 ° C, the performance of your parts and assemblies needs to be verified. Factors that affect performance include the configuration and stress sensitivity of the part, the cooling rate and residence time, and the temperature history previously experienced. For example, the special material of Tensan Potting Elastomer can be used at a temperature of -60 ℃ or lower. Under high temperature conditions, the cured product durability depends on the time and temperature. As expected, the higher the service temperature, the shorter the product can be used.

In some cases, this product will not be able to achieve the desired cure when in contact with certain plastics or rubbers. Solving this problem may be accomplished by cleaning the surface of the substrate with a solvent or baking slightly above the cure temperature.
Some chemicals, curing agents plasticizers will inhibit the curing, the following materials pay special attention to: organic compounds containing N, P, S and other ionic compounds containing Sn, Pb, Hg, Bi, As; Vinyl compounds; condensation compounds and their contaminated molds and tools.

When producing electrical / electronic equipment, it is hoped that the waste or damaged product can be recycled. Without significant damage to the internal circuitry, it is difficult or impossible to remove and re-fill non-silicone rigid potting materials. The use of Tensan silicone sealant can be easily and selectively removed, repaired or completely replaced, and re-poured into a new potting compound at the repaired site.
When removing the silicone elastomer, unwanted material can simply be torn off or removed from the area to be repaired using a sharp blade or knife. For the elastomer adhered to the part, it is best to remove it from the substrate or the circuit by mechanical methods such as scraping or rubbing.
Before re-filling the repaired parts with potting compound, sand the surface of the cured potting compound with sandpaper and wipe it with a suitable solvent. This helps to increase the cohesion, combining the repaired material with the existing potting compound. Silicone primer should not be used as the product's own adhesive.

8.Operational precautions
1. Before use, please stir, especially up and down mixing;
2.Skin contact with plastic soap and water rinse to clean, if you accidentally come into contact with the eyes, immediately rinse the eyes with plenty of water for at least 15 minutes, if the pain should be immediately medical treatment;
3. This information does not include the safety information required for the safe use of this product. Before use, please read the product and its safety data sheet as well as the container label for safe use of the product and physical and health hazard information available from TINEN.
4.A, B components in the original packaging must be stirred with a stirring device for 2-5 minutes, to avoid the transport of stratification caused by the deposition of the product effect.

9.Storage and shelf life
Products that are in an unopened, sealed condition have a shelf life of 6 months at 25 ° C in the dark (calculated on the date of manufacture on the product).

1.A component: 20kg / barrel, B component: 20kg / barrel
2.A component: 10kg / barrel, B component: 10kg / barrel
3. Need other packaging, please inform us before.

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TENSAN attend New Delhi LED EXPO with
International Partners

November 30th –December 2nd Shenzhen TENSAN Limited Company attended 2017 New Delhi LED EXPO in the capital of India with many international partners. We have made great progress in market expending, product promotion, collaborators communication and image building. We cherish this chance to India and treasure our friends and customer in India.
This is our first time to India, we are passionate about this EXPO. During the period, we have gained a lot. Firstly, we have a clear knowledge of India market, we know their purchasing needs and purchasing power, realizing that what products we should recommend to our customer.
Secondly, we got acquainted with a lot of friends and customers, we discussed about the products, which showed how professional they are. Thirdly, we visited many other booths, to learn from them. Knowing how about
New Delhi LED EXPO has shown its profession, high technology and high quality by mean of this exhibition, which provided us an excellent chance to promote our products directly. We received all straight praise via the expo.
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