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eSilicon Corporation
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Collaborate. Differentiate. Win.
Collaborate. Differentiate. Win.

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WEBINAR: Thinking about a custom IC for #DeepLearning? Learn about the #HBM2/2.5D #FinFET ASIC ecosystem for #AI. HBM2 stacks/PHY/controller; #7nm/#14nm #SerDes, TCAM, AI-optimized SRAM, 2.5D packaging. @SamsungSemiUS @NorthwestLogic @AmkorTechnology http://bit.ly/2HetCYN
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WEBINAR: Thinking about a custom IC for #DeepLearning? Learn about the #HBM2/2.5D #FinFET ASIC ecosystem for #AI. HBM2 stacks/PHY/controller; #7nm/#14nm #SerDes, TCAM, AI-optimized SRAM, 2.5D packaging. @SamsungSemiUS @NorthwestLogic @AmkorTechnology http://bit.ly/2Hhcim4
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WEBINAR: Thinking about a custom IC for #DeepLearning? Learn about the #HBM2/2.5D #FinFET ASIC ecosystem for #AI. HBM2 stacks/PHY/controller; #7nm/#14nm #SerDes, TCAM, AI-optimized SRAM, 2.5D packaging. @SamsungSemiUS @NorthwestLogic @AmkorTechnology http://bit.ly/2qPsAHF
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WEBINAR: Thinking about a custom IC for #DeepLearning? Learn about the #HBM2/2.5D #FinFET ASIC ecosystem for #AI. HBM2 stacks/PHY/controller; #7nm/#14nm #SerDes, TCAM, AI-optimized SRAM, 2.5D packaging. @SamsungSemiUS @NorthwestLogic @AmkorTechnology http://bit.ly/2vrVB1M
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The New #DeepLearning Memory Architectures You Should Know About. New white paper from eSilicon looks at #HBM2, #PseudoSRAM for #AI custom ICs http://bit.ly/2HgbA7X
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Multi-Die Packaging and Thermal Superposition Modeling white paper written by @SamsungSemiUS @AmkorTechnology and eSilicon for @semitherm 2018. Based on our recent #HBM2 2.5D networking chip. http://bit.ly/2qrpVob
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WEBINAR: Thinking about a custom IC for #DeepLearning? Learn about the #HBM2/2.5D #FinFET ASIC ecosystem for #AI. HBM2 stacks/PHY/controller; #7nm/#14nm #SerDes, TCAM, AI-optimized SRAM, 2.5D packaging. @SamsungSemiUS @NorthwestLogic @AmkorTechnology http://bit.ly/2EHJpcy
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The New #DeepLearning Memory Architectures You Should Know About. New white paper from eSilicon looks at #HBM2, #PseudoSRAM for #AI custom ICs http://bit.ly/2EGBbla
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WEBINAR: Thinking about a custom IC for #DeepLearning? Learn about the #HBM2/2.5D #FinFET ASIC ecosystem for #AI. HBM2 stacks/PHY/controller; #7nm/#14nm #SerDes, TCAM, AI-optimized SRAM, 2.5D packaging. @SamsungSemiUS @NorthwestLogic @AmkorTechnology http://bit.ly/2HifYDa
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Multi-Die Packaging and Thermal Superposition Modeling white paper written by @SamsungSemiUS @AmkorTechnology and eSilicon for @semitherm 2018. Based on our recent #HBM2 2.5D networking chip. http://bit.ly/2ILJ8YH
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