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Terahertz Imaging and Spectroscopy, THz Instruments by TeraView
Terahertz Imaging and Spectroscopy, THz Instruments by TeraView

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TeraView will be attending EAS, Eastern Analytical Symposium. November 16-18, 2015 at the Garden State Exhibit Center, Somerset, New Jersey.

TeraView's Principal Scientist Dr. Philip Taday will be presenting a talk on Monday 16th November at 10.20am, by the title of: ‘Terahertz Systems for Cultural Heritage’
Tiphaine Bardon from UCL will follow the talk and present her work done in collaboration with TeraView using the TPS3000, titled: ‘Characterization and Imaging of Archival Texts: Let's Have a Word with Terahertz!’

Terahertz Spectroscopy Applied For Investigation of Water Structure

 Abstract

The absorption spectra of liquid water and different aqueous solutions were analyzed in a terahertz frequency domain (from 6 to 200 cm–1) which characterize the collective dynamics of water molecules. The particular attention was paid to the relaxation process in the range of ~6–80 cm-1. The physical essence of this process on the molecular level is still unclear. We found that the amplitude of this relaxation process correlates with the degree of destruction of water structure. The obtained data allowed us to interpret this process as a monomolecular relaxation of free water molecules. Based on a consideration of the water polarization in the electric field we proposed a method of calculation of the amount of free water molecules in solution.

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Teraview's TPS Spectra 3000 used to measure piezoelectric sensor adhesive bonding
http://iopscience.iop.org/1742-6596/628/1/012114/pdf/1742-6596_628_1_012114.pdf
Assessment of piezoelectric sensor adhesive bonding
Abstract

Piezoelectric transducers are widely utilized in Structural Health Monitoring (SHM). They are used both in guided wave-based and electromechanical impedance-based methods. Transducer debonding or unevenly distributed glue underneath the transducer reduce the performance and reliability of the SHM system. Therefore, quality assessment methods for glue layer need to be developed. In this paper, the authors present results obtained from two methods that allow the quality assessment of adhesive bonds of piezoelectric transducers. The electromechanical impedance method is utilized to analyze transducer adhesive bonding. An improperly prepared bonding layer is a source for changes in the electromechanical impedance characteristics in comparison to a perfectly bonded transducer. In the resistance characteristics of the properly bonded transducer the resonance peaks of the structure were clearly visible. In the case when adhesive layer is not equally distributed under sensor, the amplitudes of structural resonance peaks are reduced. In the case of completely detached transducer, the structural resonance peaks disappear and only resonance peaks of the transducer itself are visible. These peaks (peaks of free transducer hanging on wires) are significantly larger than the resonance peaks of the investigated structure in the considered frequency interval. The bonding layer shape is also analyzed using time-domain terahertz spectroscopy in reflection mode. This method allows to visualize the adhesive layer distribution based on C-scan analysis. C-scans of signals or envelope-detected signals can be used to estimate the area of proper adhesion between bonding agent and transducer and hence provides a more quantitative approach towards transducer inspection. 


Teraview's TPS Spectra 3000 was used the investigate the materials used in the paper.
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