congatec introduces next generation COM Express compact modules with 6th generation Intel® Core™ processors
New performance levels for 15 watt class of fanless embedded systems achieved
congatec AG, a leading technology company for embedded computer modules, single board computers (SBCs) and embedded design and manufacturing (EDM) services, has introduced four new COM Express compact modules parallel to the launch of the new 6th generation Intel® Core™ processors (codename Skylake). The new modules are specially designed for challenging applications that demand high performance in sealed, fanless system designs. They feature a 15 watt configurable TDP and are equipped exclusively with the energy-saving ULV-SoC editions based on new 14nm microarchitecture. Compared to 15 watt modules with fifth generation processors (codename Broadwell), users benefit from improvements in graphics and processing performance, enhanced energy efficiency and more high-speed I/Os.
Typical fanless applications for congatec COM Express compact modules can be found in medical and industrial imaging, central control room technology, shop floor terminals, HMIs, robotics, professional gaming, infotainment, professional AV, smart video surveillance, autonomous vehicle control, computer-aided situational awareness as well as high-end digital signage applications. Graphics card free, triple-head systems – for example in the areas of retail and kiosks, where embedded systems control up to three independent cash or vending machines – present a further application example.
“We have made the new conga-TC170 COM Express compact modules available parallel to the launch of the new Intel Core processors as our customers want to get this latest technology out in the market as fast as possible“, explains Gerhard Edi, CTO at congatec.
"congatec's new Computer-on-Modules built with 6th generation Intel Core processors provide blazing fast compute and graphics performance, additional high speed I/Os for greater system flexibility, and a wide range of power, feature, and performance options to meet any IoT application", said Samuel Cravatta, product line director, Internet of Things Group, Intel.
Find out more: http://www.congatec.com/en/congatec-ag/press-releases/article/congatec-introduces-next-generation-com-express-compact-modules-with-6th-generation-intelR-coreTM-processors.html