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Various types of applications require different types of boards. For example, a Microvia PCB is more prevalent and can be found in electronic things from regular use buyer. Such a board, when bent to a specific maximum, will break or break. There are also different types of flexible PCB boards available. The circuits in the PCB are made of thin and flexible insulation material. You can see the use of flexible PCBs in medical equipment, flexible heaters or even equipment such as hearing aids.

One of the methods used to increase the density of the electrical circuit on the printed circuit board - PCB is to use blind and buried vertical interconnect access. In case you prefer not to extend through the printed circuit board, the blind and hidden vertical interconnect access will fulfill the function and will only pass partially between the multilayer circuits, joining just the inner layers that require association. Because of this vertical interconnect access, the entire multilayer is not experienced, the availability of area in the other layers becomes a useful additional circuit routing.

The microvia PCB type is a flexible and inflexible PCB combination that you could be looking for. These circuits are used in military space and aerospace applications, where a very dense circuit is needed. The rigid-flexible PCB helps a substantial amount of space, resulting in electronic items that measure much less.

The term buried vertical interconnect access is those that are not visible from the exterior of the fabricated circuit board, and are formed in a sub-composite or copper-coated laminate. The vertical blind interconnects access those that are visible on the outside of the PCB, however, do not entirely pass through the board. By using the size of these small vertical interconnection ports, this interconnection density increases significantly on board. The Microvia printed circuit board uses these technologies to improve circuit density; For example, a cell phone that is using microvia technology due to the request of smaller packaging devices. Procedures used to shape microvessels include laser ablation, plasma etching, and photographic imaging.

The manufacture of PCBs can be carried out during a certain number of circuits or for the production in series. It is essential to choose a PCB manufacturing company that has a proven track record. Getting your new electronics configuration ready for mass production and PCB involves several advances and risks. These recommendations will surely help you get the best PCB possible according to your requirements.
The printed circuit material used in the Microvia contours utilizes an organic reinforcement that can be plasma-scribed. The widely used organic reinforcing material is based on aramid fiber. The aramid fibers are formed in a sheet which is impregnated with the resin system. With this method, both copper-coated laminates and prepregs can be manufactured and used in multi-layer applications.
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PCB Assembly


Single circuit board and the double-sided circuit board, multilayer circuit board, flexible circuit board, rigid-flex circuit board, heat sink PCB, metal clad PCB, metal core PCB and lead-free PCBs made of FR4-370HR, hybrids, Getek®, FR408, polyimide, thermal on and PTFE materials can be assembled. Capabilities include prototyping and fabrication. Drilling, milling, notching, routing, shearing, beveling, punching, scrubber, grinding and multilayer laminating services are available. Aerospace, industrial, communications, electronics, transportation, and medical markets are served. Meets UL® standards and military specifications.

Rigid pcb assembly and flexible pcb assembly, copper clad, single and double-sided pcb assembly, metal core insulated, multilayer pcb assembly, plated-through-hole (PTH), and surface mount circuit boards can be prototyped. Fiberglass, Getek®, phenolic, polyester, polyimide and PTFE materials are handled. Available in lengths ranging from 3 in. to 15 in., widths from 3 in. to 18 in. and thicknesses from 0.032 in. to 0.187 in. Circuit boards are manufactured in layers ranging from 2 to 18. Industries served include aerospace, automotive, government, medical, material handling and processing, military, mining, oil and gas, telecommunications. JIT delivery, emergency and rush services are available.

Custom pcb assembly manufacturer offering electronic through-hole, BGA, and surface-mount printed circuit board (PCB) assemblies. Offers lead-free and leaded types. Capabilities include wiring and final assembly, potting, device programming, diagnostic and functional testing, and no clean soldering. Serves industries such as radio, microphone, and automatic door equipment, semi-body alignment systems, pump controllers, battery chargers, and solar cells. Provides Kanban, release, and safety stock program, direct drop shipping, and scheduling services.

More details: https://www.hemeixinpcb.com/Aboutus/news-186.html
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Flexible circuit


The growing Hemeixinpcb customer demand for the design and manufacturing of wearables and Internet of Things (IoT) is dramatically expanding our flex circuitry design and manufacturing experience base. Not long ago, flex circuitry was considered a required item for a particular PCB design. However, today, it is taking center stage and is mainstream, not only for wearables but also for other small PCB applications.



Whereas sheet-to-sheet processes are hindered by multi-step batch handling procedures and small substrate sizes, roll-to-roll processing enables the high speed, continuous processing of a long flexible web that’s typically 100m long. With this method, production efficiency is improved dramatically, producing tens of thousands of small flexible circuit on one long continuous production web. Roll-to-roll can accommodate single- and double-sided flexible circuit and the processing of the inner layers of the multi-layer flexible circuit.



Roll-to-roll processing infrastructure requires a significant upfront capital investment in customization of all the described production equipment as well as for the other processes including the chemical lines. This investment is far larger than what’s required for sheet-to-sheet processing, so flex circuit suppliers have been understandably conservative with roll-to-roll adoption. However, by eliminating flex handling damage, the benefits of using the roll-to-roll process for higher quality and higher yields make it cost effective.



The flexible circuit has three or additional layers of conductors are known as multilayer flexible circuit. Normally the layers are interconnected by means of plated through holes, though this is not a condition of the definition for it is probably to supply openings to access lower circuit level features. The layers of the multilayer flexible circuit may or may not be incessantly laminated mutually throughout the building with the noticeable exemption of the areas engaged by plating through-holes. The practice of irregular lamination is familiar with cases where utmost flexibility is compulsory. This is accomplished by leaving unbounded the areas wherever flexing or bending is to happen.

More details: https://www.hemeixinpcb.com/Aboutus/news-185.html
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PCB prototype

We got a PCB prototype inquiry from the US that requires high volume 8 layer 1.0mm PCB, OSP + selective ENIG surface, 5 groups impedance control, and stacked vias. These requirements are common, but there are 2/2mil lines in inner layers. It's said that this PCB prototype order was produced in Foxconn. Any PCB prototype manufacturer can do it?

I think most manufacturers cannot make this PCB board with 2/2mil line in high volume since the bad rate is high. But any way you can share your Gerber files to some professional HDI PCB prototype manufacturers, like email to sales@hemeixinpcb.com



it's said that Hemeixinpcb is trying to manufacture this PCB prototypes for check whether they can put it into mass production.

These HDI PCB prototypes have succeeded yesterday. I'm proud I have a chance to review the working Gerber in the MI department. Hemeixinpcb proved their processing capacity and confirmed they can manufacture this 4+n+4 PCB in high volume.

* 18 groups controlled impedance with single-sided and diff.

* 1.8, 2.1, 2.2, 2.3, 2.5, 2.6, 3.0 mil lines in inner &outer.

* 8 BGA with via-in-pad. * staggered vias, blind vias & buried vias.

More details: https://www.hemeixinpcb.com/Aboutus/news-184.html
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PCB assembly services for electronic projects. Capable of handling single to multi-board and multilayer projects with surface mount pcb assembly, through-hole pcb assembly, and surface mount pcb assembly and through-hole pcb assembly combination components. Offers simple to complex project design, development, and engineering. PCB assembly serves industries such as petrochemical, oilfield service, mining, power generation and transmission, professional audio, and law enforcement. Product modifications, upgrades, and warranty repairs are available.



Production pcb assembly, quick turn pcb assembly & prototype pcb assembly. Single sided, double sided & multi layer printed circuit boards. Single sided up to 40 layer multilayers. PCB's with lines & spacing down to .003 in./.003 in. mils. All pcb assembly boards can be made to RoHS & offering the latest millenium metallic finishes.



PCB assembly capabilities include rapid prototyping, automated optical inspection, potting, testing services, lead and lead free pcb assembly processing, soldering and box builds/ turn-key pcb assembly. Through hole components pcb assembly, component packages and surface mount technology are also available. Industries served include commercial, aerospace, defense, telematics and automotive. RoHS and non-RoHS compliant.

More: https://www.hemeixinpcb.com/Aboutus/news-180.html
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The primary benefit of heavy copper pcb boards is their capability to survive frequent exposure to excessive current, elevated temperatures and recurring thermal cycling, which can destroy a regular circuit board in seconds. The heavy copper pcb board has a high tolerance capacity, which makes it compatible with applications in rough situations such as, defense and aerospace industry products. Some of the added advantages of heavy copperpcb boards are:



-Compact product size due to several copper weights on the same layer of circuitry

-Heavy copper-plated vias pass the elevated current through the PCB and assist in transferring the heat to an outer heat sink

-Onboard high-power-density planar transformers



Heavy copper pcb is not a new innovation, as it has been used for a long time in PCBs that can withstand the exacting requirements of military and defense applications, such as in weapons controls. Mainstream electronics makers increasingly require ways to transfer heat away from components, and heavy copper pcb is becoming more prevalent in an growing number of non-military uses.



Many designers and assemblers do not know what is readily available in high current heavy copper PCB. Heavy copper pcb boards can contain 3 ounces to 40 ounces of copper conductors. Quite surprisingly, a heavy copper PCB (10 ounces heavy copper pcb) can also have very fine features.

More: https://www.hemeixinpcb.com/Aboutus/news-179.html
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Have anyone has experience in SMT on flexible circuits?



I used to work for a flexible circuits house and was responsible for the SMT assembly flexible circuits area. What is your question?



I didn't pose the question -- but have some: As the substrate is flexible circuits -- how do you hold the flexible circuits substrate flat for paste application and then flat enough for larger (>1" long SMT components to be placed without coplanarity issues> Also, what types of finishes are common for the flexible circuits;i.e, ENIG, immersion Ag, etc.?



In a previous life, we built some flexible circuits for a customer. The configuration was a flexible circuits cable, with a flexible circuit at one end of it. We had fixtures made out of the same material that we had selective wave solder fixtures made from. Cut an indention in the material in the shape of the flexible circuits, and included a clip to hold the circuit securely in place.



I didn't work on it personally, but it seemed to work through screening, pick/place, and reflow (conveyorized line).



well we are running flex panel(150x270) with one connector(3 pin legs both sides) insert. Each panel consists of 28 parts and its used for disk drive industries. We are having a pallet to support with the top cover design such away the connector area is open and each open area a bridge are crossing to hold the connector. Im using lead free type(brand avantec) 1) facing problem on leg shifted 2) solder fillet

by the way do you think that aqueous cleaning system is playing important role??



We were using pallets (delmat with cavities for the flexible circuits) We put stips of double sided Kapton tape in the critical areas. The tape held up to the heat and kept the flexible circuits flat for the QFP's and BGA's. We based our flexible circuits assembly process for this flexible circuit around the carrier pallet. After the flexible circuit was loaded, we used the pallet for printing (Manual), placement and reflow. We then removed the circuit and ran through an in-line aqueous cleaner in a basket with spring clips to secure the flexible circuit to prevent damage.

We also had some applications where we used a vacuum table to secure the flexible circuits for placement but you need to maintain planarity throughout the entire process through reflow or you will see the same sort of problems.



I think every application has different requirements but we found that utilizing a carrier thoughout the process eliminated quite a few problems.



Please let me know if you would like to discuss this further.

More: https://www.hemeixinpcb.com/Aboutus/news-178.html
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A microvias pcb is obviously a smaller via pcb , but exactly how small are they? Most people consider microvias to be a via with a diameter less than 150 µm. These tiny holes are drilled by lasers, a process that is constantly being improved. New advances in laser drilling techniques could reduce microvias down to 15 µm. The lasers involved can only drill through one layer at a time. However, HDI microvias pcb manufacturers can make through microvias by drilling them separately in multiple layers and stacking them.





Microvias PCB have a lower potential for manufacturing defects than normal vias. This is because laser drilling doesn’t leave any material behind in the drilled out holes. However, microvias PCB have the same risks as normal vias when it comes to plating and solder reflow. Thus, it’s important that you discuss tenting or filling your microvias with your manufacturer.







I need some help with my microvias PCB. I will design a 10 Layer microvias PCB with micro-vias and buried-vias. I asked my microvias PCB manufaturer for a matching microvias PCB stack-up and for the design rules.



Now I need micro-vias from the top-layer to the inner 1 layer and from the inner 8 layer to the bottom-layer. That works fine, i can choose it in the microvias pcb board settings. But, I need also buried-vias from the inner 1 layer to the inner 8 layer, and there is my problem, because I can't choose it. Have you guys any suggestions how i can solve this problem ?



Microvias PCB are used in conjunction with build-up layers and are generally blind or burried vias; they connect one or two (maximum) build-up layers to the copper top or bottom. If you are unable to select this option in the PCB Properties, it is likely that you do not have any build-up layers on the top/bottom of board. Here are some general steps to follow to place micro vias:



1. Under Options > PCB Properties, check the Micro Vias box found under the Vias Support group (note: you must have build-up layers on the top or bottom of your board. You can change the number of single layer build-ups on the left)

2. In the Allowed Vias box, select the layers between which you would like to allow micro vias

(If you would like to allow micro vias between more than one layer (maximum of two), you can change the settings in the Pads/Vias tab under Maximum Layer Span. Make sure to click Apply before you return to the PCB Properties tab)

3. After you have finished selecting the allowable layers, click OK and return to your design

4. Place a via (Place > Via)

5. In the dialog that pops up, select the layers between which you would like the via placed. If you select a combination of layers that was enabled in the PCB Properties, Ultiboard will automatically know that you would like to place a micro via and will configure the hole size and annular ring based on this. Now if you double-click on the via that was just placed, the heading of the properties dialog should say Micro Via Properties, which will show you that it you have configured it properly.



If you need a via that goes all the way through the board, I do not believe this fits the actual definition of a micro via. You should really contact your microvias pcb board manufacturer to find out how small they are willing to go, but based on the IPC-2222 Sectional Design Standards for Rigid Organic Printed Boards, the minimum drilled hole sizes for plated-through hole vias should be at least 0.2 mm, but obviously larger as the thicknesse of the board increases. And then you also have to take into account the annular ring of the via.



The via-in-pad process supports more technology on fewer layers, proving that bigger is not always better. Since the late 1980's we have seen video cameras using cartridges the size of a novel, shrink to fit in the palm of your hand. Mobile computing and working from home pushed technology further to make computers faster and lighter, allowing the consumer to work remotely from anywhere.



HDI microvias pcb Technology is the leading reason for these transformations. Products do more, weigh less and are physically smaller. Specialty equipment, mini-components and thinner materials have allowed for electronics to shrink in size while expanding technology, quality and speed.

More: https://www.hemeixinpcb.com/Aboutus/news-177.html
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Hemeixin PCB is more than just a leading PCB prototype manufacturer. We are a one-stop shop for all your PCB prototype assembly needs. We provide in-house pcb prototype fabrication, assembly and turnkey services within five days or less. Receive pcb prototype fabrication and assembly prices within minutes. Upload your pcb prototype fabrication and assembly files as one order.







Hemeixinpcb specialise in PCB Manufacturing, Printed Circuit Board, PCB Manufacture, Fast PCBs, PCB Prototype, PCB Prototypes, PCB Prototyping, Prototype PCB all at industry standard quality of course. PCB prototype and PCB Fabrication at Unbeatable Prices, Unbelievable ? Get a Quote to find out today from http://pcbonline.hemeixinpcb.com/.



Hemeixinpcb offers best mix of price and quality for your PCB prototype order or or quick turn PCB order, we pride ourselves for our 99% on-time rate. Hemeixinpcb's makes your PCB prototype procurement total security and satisfaction.

More: https://www.hemeixinpcb.com/Aboutus/news-176.html
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I have a 1oz flex pcb (FPC) that has 2 0.4mm pitch connectors that need to be SMT and 9 4.5x1.0mm pads that have conductive rubber contacts that are press fitted onto the flex pcb. The flex pcb has a one time bend radius of 15.5mm. Image is attached that shows the rubber Contact over the flex pcb Pad.



Right now, the flex pcb finish is ENIG: Nickel thickness is 2-4um (78-156uin) and gold thickness is 0.03-0.05um (1.18-2uin). There is potential for salt water to enter the device and create a 'pool' of salt water around the rubber contact / pad which causes corrosion of the pad. There is potential for 36V to be on one of the contact with a very low current (a couple of milliamps).



I am looking to improve on corrosion and am wondering what type of finish would be best. Would going from a 2uin thick layer with ENIG Finish to a 8uin thick ENIG Finish, will that give us a large improvement and help against our corrosion issue? Or, do we move to a Hard Gold finish that is a little thicker (i.e. 12uin) and not have issues with soldering the 0.40mm pitch connector? If I move to a Hard Gold finish, are there any layout things I need to consider?







Sorry. I'm not connecting. What are you talking about: * Bare ENIG pads * ENIG pads that have SMT and other components solder connected to the pads



So, you've got this ENIG board in an enclosure that takes-on water ... What is getting corroded? Talk more about that ...



Sorry if I was not clear. We have a flex pcb Circuit Board that is ENIG Finished. There are two connectors that are SMT to either side of the flex pcb to connect to other PCBs within the system. Then, we have conductive rubber contacts that are press fit on top of the bare contacts (No solder/SMT) on the flex pcb (Which are ENIG finished).

The flex pcb board takes in salt water (not immersed, sprayed onto the enclosure) and the pads that the conductive rubber contacts sit on get corroded . This is the area where the salt water gets into when the user sprays the outside enclosure. There is an external object with gold contacts that gets placed in these contacts and the user then sprays salt water onto the object. There is potential for the salt water to get through the contacts and onto the flex pcb. Through these contacts, there could be up to 36V (2mA).



Gold should not be corroding in salt water. I have swum hundreds of miles in salt water with my wedding ring on my finger. My ring is a shiny and corrosion-free as the day it was cast over 120 years ago.



It's possible that your gold thickness of 0.03-0.05um (1.18-2uin) is porous. In fact, it probably IS porous. But even if the gold is porous, the electroless nickel is corrosion resistant

More: https://www.hemeixinpcb.com/Aboutus/news-175.html
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