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Trenz Electronic GmbH

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Preorder your +Digilent, Inc. Arty S7 FPGA board with the brandnew Xilinx Spartan-7 FPGA in our online shop!
Trenz Electronic is an authorized distributor for Digilent products in Germany.

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Our booth at the FPGA congress in Munich:
3 Photos - View album

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Last, but not least, number 5 of our modules with a single-core:
TE0715 integrating a Zynq-Z012S from Xilinx, Inc.
- Single-Core ARM Cortex-A9 MPCore up to 766MHz
- 1 GByte 32-Bit DDR3L SDRAM
- 32 MByte QSPI Flash memory (with XiP support)
- 10/100/1000 tri-speed gigabit Ethernet transceiver (PHY)
- Plug-on module with 2 x 100-pin and 1 x 60-pin high-speed hermaphroditic strips
- MAC address EEPROM
- 4 GTP/GTX tranceivers

Further informations and ordering:

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Introducing the IceZero FPGA board for Raspberry Pi!
Open Source module with a Lattice ICE40HX
Size: 56 x 30.5 mm

Now in stock, delivery time appr. 1-3 workdays:

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FREE High Speed Adapter with Digital Discovery by +Digilent, Inc. purchase (first 100 buyers)!
Further informations:

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Introducing No. 4 of our new Zynq-7000S SoC series:
TE0722 with a Xilinx Zynq XC7Z007S-1CLG225C
DIPFORTy1 "Soft Propeller" with Xilinx Z-7007S Single-core and 16 MByte Flash with just a form factor of 18 x 51 mm
Order number TE0722-02-07S-1C
Further information and ordering:

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Brandnew and in stock now:

TE0713 - a FPGA module with
- +Xilinx Inc. Artix-7 100T or 200T
- 1 GByte DDR3L
- 32 MByte QSPI
- USB 3.0 to FIFO interface bridge
- 4 GTP
- Programmable Clock Quad Generator
- plug-on module with 2x100-pin and 1x60-pin high-speed strips

Other assembly options for cost or performance optimization plus high volume prices available on request.

Further information and overview of variants:

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Introducing No.3 of our new Zynq-7000S SoC series!
TE0720-03-14S-1C - a 4 x 5 cm plug-on module integrating a Zynq Z-7014S from +Xilinx Inc.
- 32 MByte QSPI Flash memory for configuration and operation
- Gigabit Ethernet transceiver
- 4 GByte e-NAND (up to 32 GByte)
- USB 2.0 high speed ULPI transceiver
- ...
Further informations and ordering:

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Wir werden als Aussteller an beiden Tagen teilnehmen.

"Motion & Smart Power, High Speed Interfaces & FPGA Summit" 19.-20. Juni 2017
Leonardo Royal Hotel Frankfurt

Die „ARROW Technologies Days“ befassen sich mit den Designfragen und modernen Lösungsansätzen für Motion Control, Smart Power Design, High Speed Interfaces und FPGA-Applikation. Zielgruppen sind Entwickler und Entwicklungsleiter mit dem Fokus Hardwareentwicklung, Analog- und Power-Design sowie High-Speed- und FPGA-Design.

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