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Palomar Technologies, Inc.
77 followers -
Automated die bonder & wire bonder manufacturer; Optoelectronics/Microelectronic contract assembly
Automated die bonder & wire bonder manufacturer; Optoelectronics/Microelectronic contract assembly

77 followers
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Palomar Technologies, Inc.'s posts

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Consequences of High Voids in the Package Seal Ring: read more about it in this week's blog from SST Vacuum Reflow Systems.

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Why or When One Should Use a Vacuum/Pressure Reflow Oven System as Opposed to Other Packaging Technology Systems (何时或何故以真空/压力回流炉系统取代其他封装技术系统).

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This week's topic: High Vacuum MEMS Sealing Technology. Check it out! 

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We've compiled some frequently asked questions about our 9000 Wedge Bonder into a new eBook! Download it free here: http://hubs.ly/H07sRWc0

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We've compiled some frequently asked questions about our 8000i Wire Bonder into a new eBook! Download it free here: 

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Immediate Production Required: Need to Build Parts Soon? Check out this week's blog for a solution.

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There are two types of heater stages utilized in bonding and die attach: Pulsed Heat Stages and Steady-State Heater Stages. Both types of heater stages are carefully engineered and controlled for process precision, and there are some fascinating components at play in their respective designs. Read about them in this week's blog!

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Internal applied testing of new features as well as development of feature ideas are critical parts of Palomar’s software development process. Learn more about some of software's recent developments in this week's blog!

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Take a look inside our Palomar Technologies GmbH office!

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Optoelectronics Drive Advanced Packaging: read about it in this week's blog!
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