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MonolithIC 3D Inc.
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MonolithIC 3D Inc.

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Qualcomm is looking to leverage Monolithic 3D IC technology to win market share in the 8 billion dollar smart phone market.
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MonolithIC 3D Inc.

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28nm is still the last node of Moore's Law, says Zvi Or-Bach of MonolithiC 3D Inc., who beats the drum for monolithic 3D.
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MonolithIC 3D Inc.

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Join us at the 2015 CMOS Emerging Technologies Research Conference on May 20th thru 22nd, 2015 in Vancouver, Canada. MonolithIC 3D Inc.'s members are invited to give a presentation on our technology.  The paper is entitled: 'Monolithic 3D Technology: Keeping Alive Transistor Economic Scaling, and Current Applications', http://www.cmosetr.com/session_listing.php?event=2015&session=R3
Detailed list of presenters and talks in the CMOSETR 2015 program
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"Precision Bonders–A Game Changer for Monolithic 3D" @ 3D Architectures for Semi Integration and Packaging on 12/10 in Burlingame, CA https://techventure.rti.org/Agenda.html
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"Monolithic 3D Advantage", E-book. Latest version has an update with chapters on "Precision Bonders" & "Heat Removal", you an download it from: http://www.monolithic3d.com/-papers-presentations-and-patents.html
MonolithIC 3D Inc. is an IP company with operations in Silicon Valley, Romania and Israel. It invented and developed a practical path to the monolithic 3D Integrated Circuit, which includes multiple derivatives for Logic, Memory and Electro Optic devices.
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MonolithIC 3D Inc.

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Monolithic 3D: The Most Effective Path for Future IC Scaling
It is well recognized that dimensional scaling has reached its diminishing return phase. The industry is now looking at monolithic 3D to be the future technology driver. Yet, until recently, the path to monolithic 3D has required the development of new transistor types and processes. This Webcast will present game-changing monolithic 3D process flows, which use the existing transistor of existing manufacturing line and existing process flows. Now the most effective path for future IC scaling is indeed monolithic 3D, which offers the lowest development and manufacturing cost for future ICs.  
If you have not registered yet please fill out the form below. * First Name. * Last Name. * Company. * E-mail. * Title. * Address 1: Address 2: * City. * State. * Postal Code. * Country. * Telephone. A message will be sent to the above email address confirming your registration for this webcast.
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MonolithIC 3D Inc.

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We have a guest contribution from Zvi Or-Bach, the President and CEO of MonolithIC 3D Inc.
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"Dark Silicon" is that portion of the device that needs to be shut down to avoid overheating. In a recent IEDM 2014 short course by ARM's principal engineer Greg Yeric the dark silicon was projected to be "about one-third of total area in the 20nm technology node (including 16/14nm finFETs), increasing to as much as 80% by the 5nm node," as reported by a recent Darker Silicon blog. Unlike the time that dimensional scaling could follow Dennard’s Law, it is now getting harder to thin the gate dielectric without causing extreme rise in device leakage and "as a result, while feature sizes have continued to shrink, threshold voltage has not". The following chart is from a DAC ‘13 paper titled The EDA Challenges in the Dark Silicon Era:
http://www.monolithic3d.com/blog/dark-silicon-are-dark-days-coming
We have a guest contribution from Zvi Or-Bach, the President and CEO of MonolithIC 3D Inc.
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A process flow, that could be adapted by any current fab, that leverages the precise bonder to provide a true monolithic 3D IC without the need for a new recipe for transistor formation. Fusion Bonder has an alignment precision of 200nm.
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Architectures for Semiconductor Integration and Packaging | December 10-12, 2014, in Burlingame, California
Join us at the 3D Architectures for Semiconductor Integration and Packaging 2014 in Burlingame, California on December 10-12. Zvi Or-Bach, President and CEO of MonolithIC 3D Inc. is invited as a key speaker in the 7th Session on "Monolithic 3D Integation – An Emerging Reality?". Mr. Or-Bach will present "Precision Bonders – A Game Changer for Monolithic 3D", https://techventure.rti.org/Agenda.html
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It is well known that high cost is the number one issue which slows down the adoption of 3D ICs based on TSV. The proposed monolithic 3D flow has the potential to overcome these barriers as it avoids use of a thick layer with lengthy etch and deposition processes. In fact, it can provide circuit fabrics for two strata for a cost that is less than one wafer substrate. 
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Have them in circles
102 people
Ramon Knif's profile photo
Excelta Corporation's profile photo
Arul Kitnan's profile photo
roshniiii's profile photo
Micross Components's profile photo
Brian Bramzwig's profile photo
Alvaro Agudelo's profile photo
MemoTrek™ Technologies's profile photo
Cage Chen's profile photo
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408-372-7101
Email
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408-912-2303
Address
3555 Woodford Drive San Jose, CA 95124
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MonolithIC 3D Inc. , the Next-Generation 3D-IC Company.
Introduction
MonolithIC 3D Inc. is an IP company with operations in Silicon Valley, Romania and Israel. It invented and developed a practical path to the monolithic 3D Integrated Circuit, which includes multiple derivatives for Logic, Memory and Electro Optic devices.