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MonolithIC 3D Inc.
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MonolithIC 3D Inc.

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"Dark Silicon" is that portion of the device that needs to be shut down to avoid overheating. In a recent IEDM 2014 short course by ARM's principal engineer Greg Yeric the dark silicon was projected to be "about one-third of total area in the 20nm technology node (including 16/14nm finFETs), increasing to as much as 80% by the 5nm node," as reported by a recent Darker Silicon blog. Unlike the time that dimensional scaling could follow Dennard’s Law, it is now getting harder to thin the gate dielectric without causing extreme rise in device leakage and "as a result, while feature sizes have continued to shrink, threshold voltage has not". The following chart is from a DAC ‘13 paper titled The EDA Challenges in the Dark Silicon Era:
http://www.monolithic3d.com/blog/dark-silicon-are-dark-days-coming
We have a guest contribution from Zvi Or-Bach, the President and CEO of MonolithIC 3D Inc.
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A process flow, that could be adapted by any current fab, that leverages the precise bonder to provide a true monolithic 3D IC without the need for a new recipe for transistor formation. Fusion Bonder has an alignment precision of 200nm.
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Architectures for Semiconductor Integration and Packaging | December 10-12, 2014, in Burlingame, California
Join us at the 3D Architectures for Semiconductor Integration and Packaging 2014 in Burlingame, California on December 10-12. Zvi Or-Bach, President and CEO of MonolithIC 3D Inc. is invited as a key speaker in the 7th Session on "Monolithic 3D Integation – An Emerging Reality?". Mr. Or-Bach will present "Precision Bonders – A Game Changer for Monolithic 3D", https://techventure.rti.org/Agenda.html
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It is well known that high cost is the number one issue which slows down the adoption of 3D ICs based on TSV. The proposed monolithic 3D flow has the potential to overcome these barriers as it avoids use of a thick layer with lengthy etch and deposition processes. In fact, it can provide circuit fabrics for two strata for a cost that is less than one wafer substrate. 
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Monolithic 3D low cost flow using an existing fab transistor process to be presented at the "3D New Developments" session in the IEEE S3S 2014 Conference. http://www.monolithic3d.com/blog/game-changing-breakthrough-ieee-s3s-2014
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MonolithIC 3D Inc.

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"Any fab could utilize this breakthrough to provide far better products with minimum capital and R&D investment" - find out what this braketrough in the 3D technology is at the IEEE S3S Conference 2014: http://www.monolithic3d.com/blog/game-changing-breakthrough-ieee-s3s-2014
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MonolithIC 3D Inc.

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Join us at the 2015 CMOS Emerging Technologies Research Conference on May 20th thru 22nd, 2015 in Vancouver, Canada. MonolithIC 3D Inc.'s members are invited to give a presentation on our technology.  The paper is entitled: 'Monolithic 3D Technology: Keeping Alive Transistor Economic Scaling, and Current Applications', http://www.cmosetr.com/session_listing.php?event=2015&session=R3
Detailed list of presenters and talks in the CMOSETR 2015 program
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MonolithIC 3D Inc.

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"Precision Bonders–A Game Changer for Monolithic 3D" @ 3D Architectures for Semi Integration and Packaging on 12/10 in Burlingame, CA https://techventure.rti.org/Agenda.html
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"Monolithic 3D Advantage", E-book. Latest version has an update with chapters on "Precision Bonders" & "Heat Removal", you an download it from: http://www.monolithic3d.com/-papers-presentations-and-patents.html
MonolithIC 3D Inc. is an IP company with operations in Silicon Valley, Romania and Israel. It invented and developed a practical path to the monolithic 3D Integrated Circuit, which includes multiple derivatives for Logic, Memory and Electro Optic devices.
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MonolithIC 3D Inc.

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TODAY! Monolithic 3D low cost flow using an existing fab transistor process to be presented at the "3D New Developments" session in the IEEE S3S 2014 Conference, http://www.monolithic3d.com/blog/game-changing-breakthrough-ieee-s3s-2014
We have a guest contribution from Zvi Or-Bach, the President and CEO of MonolithIC 3D Inc. Mr. Or-Bach discusses about  the emergence of monolithic 3D technology in the near future.
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San Jose, CA (PRWEB) October 01, 2014 -- In the upcoming 2014 IEEE S3S conference (October 6-9), MonolithIC 3D will unveil a breakthrough flow that is game-changing for 3D IC technology.
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First time ever a process flow for monolithic 3D. Learn about it in premier  at the IEEE S3S 2014 Conference. Hot topics: SOI, Sub-threshold, and 3D IC technologies: http://www.eetimes.com/author.asp?section_id=36&doc_id=1323855
It is fitting that the IEEE S3S Conference 2014 would be the forum at which a key decisive breakthrough for monolithic 3D IC technology will be presented.
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408-372-7101
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408-912-2303
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3555 Woodford Drive San Jose, CA 95124
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MonolithIC 3D Inc. , the Next-Generation 3D-IC Company.
Introduction
MonolithIC 3D Inc. is an IP company with operations in Silicon Valley, Romania and Israel. It invented and developed a practical path to the monolithic 3D Integrated Circuit, which includes multiple derivatives for Logic, Memory and Electro Optic devices.