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Amkor Technology, Inc.
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Amkor Technology, Inc.

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In the recently released Winter 2016 issue of MEPTEC Report, Amkor packaging experts Ron Huemoeller (Corp. VP, R&D), Adrian Arcedera (VP, MEMS & Sensors) and Rama Alapati (VP Strategic Development) discuss "The Big Five" Industry Leading Packaging Technologies. https://lnkd.in/ebJ4jHK

In an industry segment with many package options, consolidation is expected to produce "The Big Five" advanced packaging platforms. These include low-cost flip chip, WLCSP, MEMS, laminate-based advanced SiP and wafer-based advanced SiP. These selected platforms are currently in different stages of adoption and production, and will hold up through generations of development to continue serving the industry needs. Find out how Amkor is ready to support customers at every step.
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Amkor Technology has a #HRIS Analyst position available at our Headquarters in Tempe, Arizona. https://lnkd.in/eFgcmfk This position will provide primary support for Amkor US offices, foreign sales offices, as well as back up support for the Global HRIS function.
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Amkor Completes Product Qualification of SWIFT™ Packaging for Advanced Mobile, Networking and #SiP Applications. You can read the press release by visiting: https://lnkd.in/eN5TyKi
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Mike Kelly, Sr Director - Advanced Package & Technology Integration, will be presenting "Next Generation Multi-Die IC Packaging – 2.5D, 3D and Beyond" on Tuesday, December 13th from 3:40pm-4:00pm. https://lnkd.in/eWzR9Gj

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Amkor Technology Reports Financial Results for the Third Quarter 2016 https://lnkd.in/eSupxTw
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Amkor Technology has a Director, #SiP Product Marketing & Business Development for Advanced Products position available at our Headquarters in Tempe, Arizona. https://lnkd.in/eBG3g7b This position is responsible for the business development and product technology #marketing, focusing on Advanced Products System-in-Package and applications.
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Visit Amkor Technology and J-Devices today at INTERNEPCON JAPAN. Our technical staff is on hand at booth #E31-4 to greet visitors and discuss our state-of-the art packaging, design and test solutions.
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Fumihiko Taniguchi, Senior Manager, Packaging R&D Center, will present "J-Devices' Semiconductor Package Technology for Automotive" on Thursday, Jan 19th at Automotive World 2017 in Tokyo, Japan. 
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Amkor Technology was recently awarded the CSO50 Award for the second year in a row – being recognized for a continued commitment to improving Information Security for both customers and internal teams. https://lnkd.in/gPtRA4Z
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Amkor Technology was recently recognized by Genapsys for its devoted service and generous support in developing Genapsys' first generation sequencing module assembly.
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Amkor was mentioned in today's article from SEMI titled "Fan-Out Wafer Level Packaging Takes Off" https://lnkd.in/eEJe499
Fan-Out Wafer Level Packaging Takes Off By Clark Tseng and Dan Tracy, SEMI Fan-Out Wafer Level Packaging (FOWLP) has become the buzz word and hot topic for the semiconductor industry. As TechSearch International discussed at the recent SEMI Strategic Materials Conference, FOWLP offers numerous performance and cost advantages in terms of smaller form factor and thinner package, higher I/O density, multi-die solutions, and more.
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Amkor has a Sr. Director, SAP CoE Head position available at our Headquarters in Tempe, Arizona. https://lnkd.in/es_ehbk This SAP CoE Leader oversees all +SAP related services globally to ensure continuous operations for a 24X7 business. The responsibilities include SAP architecture, enhancement, maintenance, support and #SAP functional implementation expertise
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Amkor Technology provides semiconductor design, assembly & test services in Asia, Europe and the USA. We offer advanced innovations in Copper Pillar, TSV, Flip Chip, WLP, MEMS, PoP & 3D Packaging.
Introduction
Amkor is one of the world’s largest providers of contract semiconductor assembly and test services. Founded in 1968, Amkor pioneered the outsourcing of IC assembly and test and is now a strategic manufacturing partner for more than 200 of the world’s leading semiconductor companies and electronics OEMs. Amkor’s operational base encompasses more than 5 million square feet of floor space with production facilities, product development centers and sales & support offices located in key electronics manufacturing regions in Asia, Europe and the United States.
Contact Information
Contact info
Phone
408-496-0303 (USA), 822-460-5190 (Korea), 81-3-5425-2830 (Japan), 33.4.50.31.88.00 (France), 65-6211-3333 (Singapore)
Email
Address
2045 East Innovation Circle Tempe, AZ 85284 USA
3945 Freedom Circle, Suite 830 Santa Clara, CA 95054 USA
Amkor Technology Euroservices SARL Archamps Technopole 60 avenue Marie Curie 74160 Archamps FRANCE
Shiba Kouen Front Tower 14F 2-6-3, Shiba kouen Minato-Ku, Tokyo 105-0011 JAPAN
Amkor Technology Singapore Holding Pte. Ltd Valley Point Office Tower 491B River Valley Road #15-02 / 04 SINGAPORE 248373