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Amkor Technology, Inc.
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Amkor Technology provides semiconductor design, assembly & test services in Asia, Europe and the USA. We offer advanced innovations in Copper Pillar, TSV, Flip Chip, WLP, MEMS, PoP & 3D Packaging.
Amkor Technology provides semiconductor design, assembly & test services in Asia, Europe and the USA. We offer advanced innovations in Copper Pillar, TSV, Flip Chip, WLP, MEMS, PoP & 3D Packaging.

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Congratulations to Amkor’s recent acquisition – +NANIUM, S.A for being named “OSAT of the Year” at the 3D InCites Awards Ceremony held in conjunction with SEMICON West.
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Amkor Technology is pleased to present the company’s recently released corporate video which can be viewed here: http://bit.ly/2uD2A2G
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Congratulations to the Amkor Technology Philippines team for their great success at this years 27th ANTS held in Pasay City, Philippines! One Best Technical Paper & four Best Presenter awards.
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Amkor’s team at IMAPS SiP 2017 in Sonoma, is available to greet customers and answer questions about Amkor's advanced #SiP packaging solutions. Stop by today or tomorrow to meet our technical staff and get some Amkor giveaways!
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Amkor has released an updated System in Package (SiP) datasheet. Download it today! http://bit.ly/2tTvWJH
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Amkor invites you to join us at PSECE 2017 being held at the SMX Convention Center in Manila, Philippines. Amkor will have 8 presentations covering all aspects of semiconductor manufacturing. For more info visit: http://bit.ly/2rrJri3
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In the recently released issue of ChipScale Review, Amkor packaging experts Yeonho Choi & Burt Barber discuss "X2FBGA: A New Wire Bond CABGA Package" http://bit.ly/2rROU1X
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Amkor Technology Recognized as Supplier of the Year for Second Consecutive Year by +Qualcomm http://bit.ly/2sDPcOv
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Amkor/+NANIUM, S.A's Steffen Kroehnert joined fellow engineers from TSMC, Deca, IZM Fraunhoffer and Qualcomm to discuss wafer processing vs. panel processing at this year’s ECTC. http://bit.ly/2sB9bxk
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