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Amkor Technology, Inc.
139 followers -
Amkor Technology provides semiconductor design, assembly & test services in Asia, Europe and the USA. We offer advanced innovations in Copper Pillar, TSV, Flip Chip, WLP, MEMS, PoP & 3D Packaging.
Amkor Technology provides semiconductor design, assembly & test services in Asia, Europe and the USA. We offer advanced innovations in Copper Pillar, TSV, Flip Chip, WLP, MEMS, PoP & 3D Packaging.

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Sivakumar Mohandass, Sr. Dir of Sales at Amkor, discussed about enabling IoT through packaging technology innovation at this years SEMICON Southeast Asia Conference in Penang, Malaysia that was held on Wednesday, April 26th.
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Amkor invites you to join us at the IMAPS SiP 2017 on June 27-29 in Sonoma, CA. To register, visit: http://www.imaps.org/sip/ This conference will bring the entire SiP supply and design chain from OEM, Fabless, IDM, OSAT, EMS, EDA, silicon foundries, equipment and material suppliers together under one roof.

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Amkor's Gerard John, Sr Dir. - Advanced Test and Adrian Arcedera, SVP - MEMS & Sensors, was recently quoted in Semiconductor Engineering's latest article, "How Testing #MEMS, #Sensors Is Different" http://bit.ly/2oYPzkX

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Amkor's Nozad Karim, VP of Electrical Engineering, wrote chapter 4, “Electromagnetic Shielding for RF and Microwave Packages”, in the 2017 edition of "RF and Microwave Microelectronics Packaging II". Check out Nozad’s contribution to this informative book today! https://lnkd.in/ems3uAn


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Download Amkor's "More Than Moore: Trends in Wafer-Level Packaging" Presentation by visiting: https://lnkd.in/eNX-zPx

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Amkor's Gerard John, Sr Director - APD Test, was recently quoted in Semiconductor Engineering's latest article, "2.5D Adds Test Challenges", discussing the advanced packaging issues in testing interposers, TSVs. Visit: https://lnkd.in/eZPdV9V


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Ron Huemoeller, CVP - R&D, sets the stage for iMAPS DPC 2017 during his keynote talking about "Heterogeneous Integration - Packaging the Future". (Photo credit: +3D InCites)

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Amkor has just released a new white paper titled "Wire-Bond CABGA – A New Near Die Size Packaging Innovation" To download, visit: https://lnkd.in/eYvHdP9

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Amkor’s Gerard John, Sr. Dir, Advanced Product Test has won the “Best Paper of Manufacturing Track” for his paper entitled “A Practical Approach to Test Through Silicon Vias (TSV)” which was presented in October at the 2016 IWLPC in San Jose. Winning papers can be downloaded at: http://www.iwlpc.com (Free to SMTA members, $10 for non-members).

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