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Amkor Technology, Inc.
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Amkor Technology, Inc.

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Amkor's Rebeca Jimenez, Sr. VP of Sales, will be a panelist on Wed. June 1st 6:30-7:30 PM at the 2016 CPMT Women's Panel & Reception - "Maximize Your Career Potential". https://lnkd.in/eYC3iFe
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Amkor Technology, Inc.

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If you missed Amkor's participation in last week's webcast with Solid State Technology, "Advanced Packaging: A Changing Landscape Rife with Opportunities", you can replay the webcast at:  http://electroiq.com/blog/2016/04/2-5d-and-3d-integration/
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REMINDER to join Amkor's Mike Kelly & Andrej Ivankovic of Yole Développement tomorrow, May 10th for the FREE webinar on "Advanced Packaging: A Changing Landscape Rife with Opportunities" https://lnkd.in/eCVaUKg
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Amkor and +Cadence Design Systems to Develop Packaging Assembly Design Kits for Amkor’s SLIM and SWIFT Packaging Technologies. By jointly developing Cadence PVS-based PADKs for SLIM & SWIFT technologies, Amkor and Cadence are filling the gap between semiconductor die design & package design, while refining design methodologies for advanced IC packaging fan-out technologies. https://lnkd.in/eScWfcG
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Amkor’s Ron Huemoeller, CVP-R&D, recently wrote an article for 3DInCites titled, "Convergence of the Big Five: Focus on Low-cost Flip Chip" http://www.3dincites.com/2016/04/the-big-five-focus-on-low-cost-flip-chip/
In the first of a five part series, Ron Huemoeller talks about low-cost flip chip as the next package platform to pick up where WLCSP leaves off.
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Amkor Technology, Inc.

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Join Amkor Technology at the TSMC 2016 Technology Symposium in Hsinchu, Taiwan on May 26th and get first-hand updates on TSMC's advanced and specialty technologies and future development plans.  Amkor will be exhibiting at this event with our technical staff on hand for any questions or discussions. https://lnkd.in/exjEJ66
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Amkor has a Sr Engineer, Design Automation opening at our Tempe, AZ location. https://lnkd.in/eJ7GPiE
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Amkor has a Technical Program Manager (TPM) opening at our Tempe, AZ location. https://lnkd.in/efU-Y45
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Amkor has a Market Research Analyst opening at our Tempe, AZ location. https://lnkd.in/evHKQ_B
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Amkor's Adrian Arcedera, VP MEMS/Sensors will be presenting "Standardization of Packaging for the Internet of Things" at the MEMS Technology Symposium on Wednesday, May 11th, 2016. https://lnkd.in/egPgEMJ
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Join Amkor's Mike Kelly & Andrej Ivankovic of Yole Développement at the upcoming FREE webinar "Advanced Packaging: A Changing Landscape Rife With Opportunities" on Tuesday, May 10th, 2016 https://lnkd.in/eCVaUKg
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Amkor has an article published in the latest issue of Chip Scale Review titled “The Internet of Things and #MEMS Packaging”, written by Vik Chaudhry, Sr Dir, Product Marketing & Adrian Arcedera, VP, MEMS/#Sensors. https://lnkd.in/eYdid3U This article covers packaging challenges of #IoT and the evolution towards standardization for MEMS and #sensor packaging.
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Have them in circles
112 people
ON Semiconductor's profile photo
Infineon Technologies AG's profile photo
Love SMG™'s profile photo
Ahmed Shehata's profile photo
Warren Gutierrez's profile photo
Mellian Cordero's profile photo
Hlias Nikolopoulos's profile photo
Esterline Research & Design's profile photo
Ron T's profile photo
Contact Information
Contact info
Phone
408-496-0303 (USA), 822-460-5190 (Korea), 81-3-5425-2830 (Japan), 33.4.50.31.88.00 (France), 65-6211-3333 (Singapore)
Email
Address
2045 East Innovation Circle Tempe, AZ 85284 USA
3945 Freedom Circle, Suite 830 Santa Clara, CA 95054 USA
Amkor Technology Euroservices SARL Archamps Technopole 60 avenue Marie Curie 74160 Archamps FRANCE
Shiba Kouen Front Tower 14F 2-6-3, Shiba kouen Minato-Ku, Tokyo 105-0011 JAPAN
Amkor Technology Singapore Holding Pte. Ltd Valley Point Office Tower 491B River Valley Road #15-02 / 04 SINGAPORE 248373
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Tagline
Amkor Technology provides semiconductor design, assembly & test services in Asia, Europe and the USA. We offer advanced innovations in Copper Pillar, TSV, Flip Chip, WLP, MEMS, PoP & 3D Packaging.
Introduction
Amkor is one of the world’s largest providers of contract semiconductor assembly and test services. Founded in 1968, Amkor pioneered the outsourcing of IC assembly and test and is now a strategic manufacturing partner for more than 200 of the world’s leading semiconductor companies and electronics OEMs. Amkor’s operational base encompasses more than 5 million square feet of floor space with production facilities, product development centers and sales & support offices located in key electronics manufacturing regions in Asia, Europe and the United States.