Profile

Cover photo
Amkor Technology, Inc.
31 followers|4,385 views
AboutPostsPhotosVideos

Stream

 
Amkor has posted a new #whitepaper titled, "Enhancing Overall System Functionality and Performance with the Right Packaging Solutions" http://lnkd.in/b9iQF-M
1
Add a comment...
 
Amkor has posted the "POSSUM Die Design as a Low Cost #3D Packaging Alternative" White Paper http://lnkd.in/bB3Ps4K #whitepaper
1
Add a comment...

Amkor Technology, Inc.

Shared publicly  - 
 
Amkor Flip Chip BGA (fcBGA) packages are assembled around state-of-the-art, single unit laminate or ceramic substrates. Utilizing multiple high density routing layers, laser drilled blind, buried, and stacked vias, and ultra fine line / space metallization, fcBGA substrates have the highest routing density available
1
Add a comment...

Amkor Technology, Inc.

Shared publicly  - 
 
Amkor’s Flip Chip molded BGA (FCmBGA) package enables thinner packaging and improves thermal performance while reducing system cost. The FCmBGA supports applications such as networking and storage, gaming, broadband communications, computer and mobile communications. http://www.amkor.com/go/FCmBGA
1
Add a comment...

Amkor Technology, Inc.

Shared publicly  - 
 
Amkor Technology has a Director, Product Management - fpfcCSP position open at our Chandler, Arizona location. http://lnkd.in/b4mhe7G
1
Add a comment...
Have them in circles
31 people

Amkor Technology, Inc.

Shared publicly  - 
 
Appearing in the most recent GSA Forum newsletter ( http://lnkd.in/b2SgAaz ), Amkor's Ron Huemoeller, Corey Reichman and Curtis Zwenger discuss how modularization has become a critical focus throughout the semiconductor industry, resulting in sophisticated packaging approaches to address the desire for miniaturization and increased levels of integration.
1
Add a comment...
 
Amkor Technology Receives Intel’s Preferred Quality Supplier Award
1
Add a comment...
 
Amkor's manufacturing sites worldwide have received certification to ISO-9001, ISO/TS-16949, OHSAS-18001, ISO-14001, and SONY Green Partner certification. In addition, our Philippines plant has ANSI/ESD S20.20, MIL/PRF-38535, and LAB Suitability MIL-883 certifications.
1
Add a comment...
 
Amkor Technology has a Sr. Financial Analyst position open at our Chandler, Arizona location.
1
Add a comment...

Amkor Technology, Inc.

Shared publicly  - 
 
Don't forget to visit our booth at the 10th International Conference and Exhibition on Device Packaging in Scottsdale today and tomorrow! Also make sure to attend our presentation of "ARM Dual Core Product Demonstration with 2.5D Through-Silicon-Via (TSV)" http://lnkd.in/bJNhGde
1
Add a comment...
People
Have them in circles
31 people
Contact Information
Contact info
Phone
408-496-0303 (USA), 822-460-5190 (Korea), 81-3-5425-2830 (Japan), 33.4.50.31.88.00 (France), 65-6211-3333 (Singapore)
Email
Address
1900 South Price Road Chandler, AZ 85286 USA
3945 Freedom Circle, Suite 830 Santa Clara, CA 95054 USA
Amkor Technology Euroservices SARL Site d'Archamps Immeuble Alliance Bâtiment C 74160 Archamps FRANCE
Shiba Kouen Front Tower 14F 2-6-3, Shiba kouen Minato-Ku, Tokyo 105-0011 JAPAN
Amkor Technology Singapore Holding Pte. Ltd Valley Point Office Tower 491B River Valley Road #15-02 / 04 SINGAPORE 248373
Story
Tagline
Amkor Technology provides semiconductor design, assembly & test services in Asia, Europe and the USA. We offer advanced innovations in Copper Pillar, TSV, Flip Chip, WLP, MEMS, PoP & 3D Packaging.
Introduction
Amkor is one of the world’s largest providers of contract semiconductor assembly and test services. Founded in 1968, Amkor pioneered the outsourcing of IC assembly and test and is now a strategic manufacturing partner for more than 200 of the world’s leading semiconductor companies and electronics OEMs. Amkor’s operational base encompasses more than 5 million square feet of floor space with production facilities, product development centers and sales & support offices located in key electronics manufacturing regions in Asia, Europe and the United States.