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Amkor Technology, Inc.
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Amkor Technology, Inc.

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Amkor Technology along with SK hynix, Inc., eSilicon, Northwest Logic and Avery Design Systems have joined forces to offer a complete High Bandwidth Memory (HBM) supply chain solution; will be offering "Start your HBM/2.5D Design Today” Seminar. For more information visit: bit.ly/20ejNbj
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Amkor Technology and J-Devices wrapped up another successful year at Automotive World 2016. The show saw over 27,000 visitors within the 3-day event. For more information visit http://www.icp-expo.jp/en/Home/
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Amkor’s Steve Kelley, CEO and President, was quoted in the Semiconductor Engineering article titled “CEO Outlook: 2016” bit.ly/1mJ9aAo
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Amkor Technology Earns #CSO50 Award for Security Innovation and Initiatives. https://lnkd.in/eHkRP6f 
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Join Amkor's Ron Huemoeller at 3D ASIP 2015 on Thursday, December 17 at 11:15AM as he presents "SLIM™ & SWIFT™: Most Advanced Interconnect First Integration Technologies" http://3dasip.org/
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Amkor's Frederic Beaudoin participated in the #IoT panel discussion at this year's Successful Semiconductor Fabless 2015. He was joined by Yole Développement, Cityzen Sciences & SigFox Wireless.
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Amkor Technology, Inc.

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Amkor is proud to announce that Curtis Zwenger, Senior Director, Advanced Package Technology and Integration, has been chosen as the new General Chair for the 13th Annual International Wafer-Level Packaging Conference held October 18-20, 2016 in San Jose, CA  For more information visit: http://www.iwlpc.com/
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Amkor’s Ron Huemoeller, CVP-R&D, was quoted in the Semiconductor Engineering article titled “Thinking Outside The Chip” https://lnkd.in/ePedvi2
Thinking Outside The Chip Intel joins AMD, IBM on advanced packaging; performance is the key driver.
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Amkor Technology Announces Acquisition of Remaining Shares of J-Devices. For more information visit: bit.ly/1S4Tvsi
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Amkor has added the white paper "Test Flow for Advanced Packages (2.5D/SLIM/3D)" to the SPN Library. This paper examines the various test insert points and proposes a suitable test flow for products that use advanced packaging technologies. Download the white paper by visiting: http://www.circuitnet.com/articles/111078.html
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Amkor's Prasad Dhond, Sr. Dir - Automotive, was quoted in 3D InSites Nov. 30th article titled, "IC Packaging: An Essential Enabler and Differentiator: Part 1"
In the first of 2 parts from The Great Miniaturization, SEMI/MEPTEC Conference, Herb Reiter talks about how IC packaging enables system scaling.
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Amkor's Frederic Beaudoin and David Hopkins participated at this year's 2015 SemIsrael Expo on November 17, 2015.  The Expo hosted over 1,000 semiconductor professionals from all the Israeli semiconductor community; local fabless & startups, local R&D offices of multinationals and IDMs, foundries, design houses, labs and universities.
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In their circles
110 people
Have them in circles
108 people
ON Semiconductor - Business's profile photo
MN Firdaus Md Nasib's profile photo
Tricia W. McGough's profile photo
Serus Corporation's profile photo
RiC Rojas IV's profile photo
Default Name's profile photo
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Contact Information
Contact info
Phone
408-496-0303 (USA), 822-460-5190 (Korea), 81-3-5425-2830 (Japan), 33.4.50.31.88.00 (France), 65-6211-3333 (Singapore)
Email
Address
2045 East Innovation Circle Tempe, AZ 85284 USA
3945 Freedom Circle, Suite 830 Santa Clara, CA 95054 USA
Amkor Technology Euroservices SARL Archamps Technopole 60 avenue Marie Curie 74160 Archamps FRANCE
Shiba Kouen Front Tower 14F 2-6-3, Shiba kouen Minato-Ku, Tokyo 105-0011 JAPAN
Amkor Technology Singapore Holding Pte. Ltd Valley Point Office Tower 491B River Valley Road #15-02 / 04 SINGAPORE 248373
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Tagline
Amkor Technology provides semiconductor design, assembly & test services in Asia, Europe and the USA. We offer advanced innovations in Copper Pillar, TSV, Flip Chip, WLP, MEMS, PoP & 3D Packaging.
Introduction
Amkor is one of the world’s largest providers of contract semiconductor assembly and test services. Founded in 1968, Amkor pioneered the outsourcing of IC assembly and test and is now a strategic manufacturing partner for more than 200 of the world’s leading semiconductor companies and electronics OEMs. Amkor’s operational base encompasses more than 5 million square feet of floor space with production facilities, product development centers and sales & support offices located in key electronics manufacturing regions in Asia, Europe and the United States.