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Amkor Technology, Inc.
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Amkor Technology, Inc.

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Amkor's Adrian Arcedera, VP MEMS/Sensors will be presenting "Standardization of Packaging for the Internet of Things" at the MEMS Technology Symposium on Wednesday, May 11th, 2016. https://lnkd.in/egPgEMJ
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Amkor Technology, Inc.

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Join Amkor's Mike Kelly & Andrej Ivankovic of Yole Développement at the upcoming FREE webinar "Advanced Packaging: A Changing Landscape Rife With Opportunities" on Tuesday, May 10th, 2016 https://lnkd.in/eCVaUKg
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Amkor has an article published in the latest issue of Chip Scale Review titled “The Internet of Things and #MEMS Packaging”, written by Vik Chaudhry, Sr Dir, Product Marketing & Adrian Arcedera, VP, MEMS/#Sensors. https://lnkd.in/eYdid3U This article covers packaging challenges of #IoT and the evolution towards standardization for MEMS and #sensor packaging.
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Amkor's Paul Silvestri, Dir - TSV Product Development, was mentioned in the article "2.5D Supply Chain Takes HBM Over the Wall" https://lnkd.in/e77JqpR
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Amkor has introduced a new, state-of-the-art fan-out structure called Silicon Wafer Integrated Fan-out Technology (SWIFT™) to bridge the gap between TSV and traditional WLFO packages. SWIFT technology enables the creation of advanced 3D structures that address the need for increased IC integration in emerging mobile and networking applications. Please visit http://www.amkor.com/go/SWIFT-Technology-Sheet to download the data sheet.
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If you missed the "Start Your HBM/2.5D Design Today" webinar, visit https://lnkd.in/eppwYuX to watch the full webinar presented by Amkor, SK hynix, eSilicon, Northwest Logic and Avery Design Systems.
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Amkor Technology, Inc.

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Amkor and +Cadence Design Systems to Develop Packaging Assembly Design Kits for Amkor’s SLIM and SWIFT Packaging Technologies. By jointly developing Cadence PVS-based PADKs for SLIM & SWIFT technologies, Amkor and Cadence are filling the gap between semiconductor die design & package design, while refining design methodologies for advanced IC packaging fan-out technologies. https://lnkd.in/eScWfcG
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Amkor’s Ron Huemoeller, CVP-R&D, recently wrote an article for 3DInCites titled, "Convergence of the Big Five: Focus on Low-cost Flip Chip" http://www.3dincites.com/2016/04/the-big-five-focus-on-low-cost-flip-chip/
In the first of a five part series, Ron Huemoeller talks about low-cost flip chip as the next package platform to pick up where WLCSP leaves off.
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Join Amkor at EDPS on April 21-22 in Monterey Beach, CA. Amkor's Paul Silvestri will present "Advanced Packaging: Architecture Paradigm Shift" during Session 3: Multi-Die IC Design and Applications. https://lnkd.in/ehcV_Xu

Presentation Synopsis:

Scaling challenges beyond 20nm combined with the emergence of advanced packaging is enabling new radical architecture changes in memory, logic, and systems.
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Stop by Amkor's booth at the UMC 2016 Technology Forum in Shanghai, China on April 15 between 9AM-5PM and see what’s in store for 2016 and how Amkor's packaging technology and services can help you with your latest project. https://lnkd.in/e7m-FMD
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Amkor has developed an innovative Silicon-Less Integrated Module packaging technology called SLIM™. This SLIM™ chip packaging technology leverages the 2.5D sub-micron routing capability and no TSV is required, which lowers cost and improves electrical performance. Please visit http://www.amkor.com/go/SLIM-Technology-Sheet to download the data sheet.
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Download the new "HBM/2.5D Design White Paper" that details the development and implementation of High-Bandwidth Memory designs. HBM is a JEDEC-defined standard that utilizes 2.5D technology to interconnect a SoC and a HBM memory stack. Many companies are already using HBM to create very high-bandwidth, low-power products. http://goo.gl/v8FSUo
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Have them in circles
111 people
‫عبدالله فلاح‬‎'s profile photo
strategic business advisers's profile photo
The Negotiation Institute's profile photo
louise Rivera's profile photo
Mutlu ÖZGÜN's profile photo
Jimmy Riddles's profile photo
Hlias Nikolopoulos's profile photo
QuadKool Productions's profile photo
Serus Corporation's profile photo
Contact Information
Contact info
Phone
408-496-0303 (USA), 822-460-5190 (Korea), 81-3-5425-2830 (Japan), 33.4.50.31.88.00 (France), 65-6211-3333 (Singapore)
Email
Address
2045 East Innovation Circle Tempe, AZ 85284 USA
3945 Freedom Circle, Suite 830 Santa Clara, CA 95054 USA
Amkor Technology Euroservices SARL Archamps Technopole 60 avenue Marie Curie 74160 Archamps FRANCE
Shiba Kouen Front Tower 14F 2-6-3, Shiba kouen Minato-Ku, Tokyo 105-0011 JAPAN
Amkor Technology Singapore Holding Pte. Ltd Valley Point Office Tower 491B River Valley Road #15-02 / 04 SINGAPORE 248373
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Tagline
Amkor Technology provides semiconductor design, assembly & test services in Asia, Europe and the USA. We offer advanced innovations in Copper Pillar, TSV, Flip Chip, WLP, MEMS, PoP & 3D Packaging.
Introduction
Amkor is one of the world’s largest providers of contract semiconductor assembly and test services. Founded in 1968, Amkor pioneered the outsourcing of IC assembly and test and is now a strategic manufacturing partner for more than 200 of the world’s leading semiconductor companies and electronics OEMs. Amkor’s operational base encompasses more than 5 million square feet of floor space with production facilities, product development centers and sales & support offices located in key electronics manufacturing regions in Asia, Europe and the United States.